KIESEL SERVOPLAN S 444 LEVELLING COMPOUN
Fast Setting Self Levelling Compound for Wood Substrates
Cement based, fibre reinforced, special self levelling compound with high quality polymer additive. Designed especially for levelling over wood substrates. Serveroplan S444 cures quickly, is highly flexible, has low tension characteristics and flows very well. Can be used under wood flooring in a minimum thickness of 3mm. Can be used as a final load top in a minimum thickness of 5mm.